Eplus3D Delivers Precision and Performance at PTXPO 2026

Chicago, USA–March 2026–Eplus3D successfully concluded its participation at PTXPO 2026, held from March 17 to 19 in Illinois. As one of North America's key events for plastics and packaging technology, PTXPO provided a valuable platform for Eplus3D to connect with manufacturers, tooling experts, and industry professionals, and to demonstrate how metal additive manufacturing can support more efficient tooling and industrial component production.

Figure - Eplus3D at PTXPO 2026

At Booth 813, Eplus3D presented a selection of tooling parts and industrial components manufactured using its metal Powder Bed Fusion (PBF) technology. The showcased applications highlighted the advantages of metal additive manufacturing in producing complex geometries, improving design flexibility, and supporting high-performance tooling applications.

Throughout the three-day event, the Eplus3D team engaged in in-depth discussions with visitors on tooling production, part performance, lead time reduction, and workflow optimization. Many conversations focused on how metal AM can help manufacturers respond to evolving production demands, especially in applications where precision, repeatability, and manufacturing efficiency are critical.

The exhibition further demonstrated the growing interest in reliable and production-oriented metal additive manufacturing solutions for tooling and industrial manufacturing. With its industrial metal AM systems, application support, and process expertise, Eplus3D continues to help customers explore new possibilities for improving tooling performance and accelerating the transition from conventional manufacturing to additive-enabled production.

Eplus3D sincerely thanks all visitors, partners, and industry professionals who visited the booth during PTXPO 2026. For those who were unable to meet us at the show or would like to continue the discussion, our team welcomes further conversations on tooling applications, material options, and customized metal AM solutions.